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Advanced FIB & TEM For Wafers Analysis

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Last update: 2026-10-17 03:20
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GRGTEST Metrology possesses patented technologies including methods for eliminating the curtain effect of the FIB focused ion beam, a novel framework structure method for preparing heat-sensitive TEM ultrathin samples using DB FIB, a FIB step-thinning method for preparing ultrathin TEM samples of brittle and easily cracked materials, a focused ion beam ultrathin sectioning pretreatment method for radiation-sensitive fine-structure wafer samples, and a method for preparing TEM samples using FIB inverted cutting. These technologies enable high-resolution TEM images with no electron beam damage, achieving atomic-level resolution morphological characterization and compositional analysis of advanced process chips.
link:http://www.grgtmall.net
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